Axcelis Technologies announced multiple follow-on shipments of the company’s Purion M™ SiC medium current implanter to several leading power device chip makers located in Europe.

The Purion M features Axcelis’ innovative solution for high temperature silicon carbide processing. The systems, which shipped in the first quarter, will be used in high volume production of power devices supporting automotive, mobile and the IoT market spaces.

Rapid growth in demand for SiC based power devices, driven largely by the transition towards electrification of the automotive industry, has created supply challenges for device manufacturers. To satisfy that demand, fabs need to maximize their yield and add capacity, while meeting a range of technical challenges unique to power devices.

Executive Vice President of Product Development, Bill Bintz, commented, “We look forward to supporting our customers as they expand their manufacturing capabilities in this growing market segment. The Purion M SiC Power Series platform’s common and flexible architecture, coupled with its uniquely differentiated high temperature capability, makes it ideally suited for this expanding application.”




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