Indium Corporation’s Robert McKerrow, Product Specialist, will host a robotic soldering webinar as part of Indium Corporation’s new InSIDER series on Webex at 8:30 a.m. EST, Thursday, May 21.
While still a growing market within the PCB assembly industry, robotic soldering continues to generate new interest in its equipment and applications every year. More efficient than hand soldering, robotic soldering features a controlled process, capable of repeatable results with increased productivity and profitability. In Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering, McKerrow will examine how cored wires with different flux percentages affect robotic soldering performance. A live Q&A session will immediately follow his presentation.
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at http://www.indium.com/webinar.
McKerrow is a Senior Product Specialist for Indium Corporation’s flux-cored wire, wave solder flux, and bar solder products. He is responsible for developing tools for improving customer response times, providing marketing support to help promote his products to key markets, and providing training for customers and internal teams. McKerrow has more than five years of experience in the manufacturing industry. He earned his bachelor’s degree in Economics from the State University of New York (SUNY) at Cortland, N.Y. and his master’s degree in Technology Management from SUNY Polytechnic Institute (SUNY Poly) in Utica, N.Y.
To register for McKerrow’s webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
