The FiRa® Consortium announced the release of the FiRa Core 4.1 Specifications and an updated 4.1 Certification Program to help advance ultra-wideband (UWB) interoperability within the FiRa ecosystem. Core 4.1 introduces enhancements for FiRa Untracked Navigation, expanded cryptographic security certification, and additional support
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Power architecture and system-level design enable next era of AI data centers
LITEON Technology and Quanta Cloud Technology (QCT) jointly showcased an AI rack-level infrastructure solution supporting the NVIDIA Vera Rubin NVL72 platform at the 2026 OCP Global Summit. The demonstration features LITEON's 110kW Power Shelf integrated within a rack-level power architecture, highlighting how
LITEON advances 800VDC grid-to-chip architecture and thermal management solutions
LITEON Technology participated in the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, showcasing its next-generation AI factory infrastructure portfolio centered on 800 VDC architecture. The exhibition features power rack solutions supporting the NVIDIA Vera Rubin platform, integrated power
Altair Semiconductor integrates Iridium NTN Direct into cellular IoT chipsets
Iridium Communications announced that Altair Semiconductor, a specialist in cellular IoT chips, is integrating Iridium NTN Direct℠ capability into Altair's ALT1350 and next-generation ALT1550 IoT chipset platforms. With terrestrial cellular IoT and Iridium satellite connectivity on a single chipset, device manufacturers, module
Toshiba’s small-package eFuse IC supports 1.7V low-voltage operation
Navitas collaborates with NVIDIA on 800V-to-12V power delivery board for next-generation AI infrastructure
Sunlight launches Battery Selector Guide to simplify industrial battery selection
PI and Ideal Power collaborate on efficient, always-on solid state circuit breakers for 800 VDC AI data centers
[SEMICON Europa] Plasmatreat showcases coordinated plasma solutions for stable surface processes in chip manufacturing
OMNIVISION launches 12MP global ahutter sensor for FA and intelligent transportation systems
OMNIVISION unveiled the new OG12S10 12‑megapixel (MP) backside illuminated (BSI) global shutter (GS) CMOS image sensor for factory automation and intelligent transportation systems (ITS). It features a large 3.45‑micron (µm) pixel, providing exceptional sensitivity and high quantum efficiency (QE). It supports an