Navitas Semiconductor has been awarded the ALATTIS (Accelerated, Large-Area, 10 kV SiC IGBT) program to develop next-generation 10 kV silicon carbide (SiC) power semiconductor technology. Following a rigorous competitive evaluation, the U.S. Army selected Navitas from among leading U.S. silicon carbide technology companies
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Aptiv begins ADAS smart camera production
NoMIS Power demonstrates 6.5KV SiC MOSFET, advancing high-voltage roadmap to 10KV and 20 KV SiC IGBTs
NoMIS Power demonstrated the 6.5KV SiC MOSFETs successfully last month. While the company’s MOSFET portfolio scales from 3.3KV (in production) through the demonstrated 6.5KV device, the highest voltage classes – 10KV and above – increasingly favor SiC insulated-gate bipolar transistor (IGBT) architectures
[SISPAD 2026] Atomera highlights advances in GaN devices
Toradex unveils SoM powered by Qualcomm Dragonwing for demanding industrial Edge AI
Toradex, a specialist in embedded computing solutions, unveiled the Aquila IQ8 - its first System on Module built on Qualcomm Dragonwing industrial-grade processors. Powered by the Qualcomm Dragonwing™ IQ-8275 processor from Qualcomm Technologies, Inc., the Aquila IQ8 brings high-end, power-efficient compute to the
Qnity unveils CMP slurry platform for advanced packaging
Qnity Electronics has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking
Diodes’ field-plated Super Barrier Rectifier® devices feature industry-leading efficiency and reliability in automotive systems
Diodes unveiled a new family of automotive-compliant* field-plated Super Barrier Rectifier (SBRFP) products that include the 2A SBRFP2M60P1Q and SBRFP2M60SAFQ, 3A SBRFP3M60SAFQ, and 8A SBRFP8A60P5Q. Serving as drop-in replacements for comparable Schottky and PN junction diodes, the SBRFP devices feature industry-leading ultra-low
EMASS goes ahead with engineering sample of next-generation 16nm ECS-DoT edge AI SoC
Valens Semiconductor collaborates with onsemi on MIPI-based integrated sensors
Valens Semiconductor announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration the parties intend to give OEMs and Tier 1s a faster path to A-PHY. Under the agreement, Valens will work with onsemi
MaxLinear unveils control-plane portfolio for next-generation AI infrastructure
MaxLinear unveiled the RackCommander™, a portfolio of connectivity, monitoring, control, and power-management products that help enable modern rack-level control-plane architectures for AI, cloud, enterprise, and edge infrastructure. Building on MaxLinear’s recently announced Coronado™ and Laguna™ USB-UART solutions for AI data center control-plane connectivity,