EPC Space, a specialist manufacturer of radiation-hardened, high-performance, and enhanced-reliability GaN discrete transistors, integrated circuits, and modular devices, unveiled three new eGaN® power transistors in plastic surface-mount packages, designed to deliver high-performance power conversion for next-generation space computing systems. The EPC7050PCSH, EPC7066PCSH
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LG Electronics accelerates robotics collaboration with NVIDIA
New prototyping test enclosures simplify speaker design
ADC Selection for Partial Discharge Pulse Analysis in High-Voltage Power Systems
Partial discharge in high-voltage distribution equipmentcan be used as an early warning indicator of insulation degradation and eventual failure, and without detection, can evolve into complete dielectric breakdown, arc faults, and potentially explosive equipment failure. If partial discharge goes unmonitored, the consequences can
GaN microLEDs for high-speed optical interconnects are further developed
THREADS program propels temperature limitations of GaN RF chips
BAE Systems’ FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency’s (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase
Ambiq’s ultra-low power SoCs feature scalable edge AI and platform enhancements for intelligent devices
Ambiq Micro unveiled Apollo330 Plus and Apollo510 Lite SoC series designed to help manufacturers bring high-performance, power-efficient edge AI devices to market faster, are now available. The Apollo330 Plus and Apollo510 Lite series span six variants—Apollo330 Plus, Apollo330B Plus, Apollo330M Plus, Apollo510 Lite, Apollo510B Lite, and
