Indium Corporation will feature its precision materials for high-reliability 5G communications during the International Microwave Symposium (IMS) virtual exhibition from Aug. 4-6.
Indium Corporation provides a suite of leading-edge materials and technology expertise to solve the evolving challenges of 5G communication applications. This includes AuLTRA® ThInFORMS™—0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers commonly used in 5G communication infrastructure.
AuLTRA® ThInFORMS™ help combat common issues, such as:
* Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
* Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
Indium Corporation also offers off-eutectic AuSn alloy options. These materials are designed to control wetting and voiding, yielding a high-reliability solder joint for critical high-power, high-frequency applications.
The IMS virtual exhibition will facilitate the benefits of a face-to-face trade show on a digital platform. For information on this topic or to chat with our experts, visit Indium Corporation’s virtual booth https://ims-ieee.org/virtual-exhibitors.
Hordon Kim, International Editor, hordon@powerelectronics.co.kr
