Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will host a webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 19 at 10 a.m. Eastern Time/3 p.m. British Time.
When the world was moving toward green manufacturing, lead-free soldering—originally driven by RoHS (Restriction on the use of Hazardous Substances in electrical and electronic equipment) of Europe —was becoming the mainstream for the electronics industry, and Sn-rich alloys—including SnAgCu, SnAg, and SnCu – had been prevailing for more than a decade. While the electronics industry keeps advancing rapidly toward miniaturization, two important drivers are dictating the evolution of lead-free solders: low cost and high-reliability. In The Evolution of Lead-Free Solder Alloys, Dr. Zhang will discuss the evolution of lead-free solders after the implementation of lead-free soldering in the industry from 2006, covering: (1) the first generation of high-Ag SAC solders; (2) low Ag/zero Ag Sn-rich solders; (3) high-reliability SAC solders; (4) low-temperature lead-free solders; and (5) high-temperature lead-free bonding materials. Zhang will also discuss the market need and the pros and cons of the representative materials in each group.
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar.
Dr. Zhang is Manager of the Alloy Group in Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving the reliability. On the basis of this technique, the Durafuse™ LT, BiAgX®, and Durafuse™ HT solder systems were invented to meet the market need. He has published more than 20 papers and journal articles. Dr. Zhang received his PhD in material science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D.
To register for Dr. Zhang’s webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Wu Chung, power@icnweb.co.kr
