Samtec, a specialist manufacturer of a broad line of electronic interconnect solutions, releasd next-gen AcceleRate HP High-Performance Arrays. AcceleRate HP supports 112 Gbps PAM4 extreme performance in an ultra-micro footprint.
AcceleRate HP High-Performance Arrays feature an open-pin-field array which maximizes grounding and routing flexibility. System architects can route high-performance differential-pairs, single-ended signals and high-current voltage rails via the same interconnect.
Additionally, the 2.2 / 2.4 / 2.2 mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and the ability to add more ground vias around the differential signals.
“Samtec’s new AcceleRate HP High-Performance Arrays set the standard for high-speed 112 Gbps PAM4 performance in a small form factor,” said Michael Boone, Product Manager, High-Speed Board-to-Board at Samtec. “Fast-growing applications such as AI accelerators, ASIC emulators and next-gen edge computing platforms leverage these unique benefits.”
Key AcceleRate HP High-Performance Arrays features include:
- Dense 0.635 mm pitch
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available
- Roadmap to 1,000+ pins
- Data rate compatible with PCIe® 5.0 and 100 GbE
- BGA termination for easy assembly and self-alignment
The new PICMG COM-HPC Specification provides system and interface flexibility by adopting a pair of 400 pin connectors based on Samtec’s AcceleRate HP High-Performance Arrays. Samtec COM-HPC Connectors link carriers to Server and Client modules. They support existing and future interfaces such as PCIe 5.0 and up to 100 GbE. The connector pairs support either a 5 mm or 10 mm stack height.
For more information on AcceleRate HP High-Performance Arrays, please visit www.samtec.com/accelerateHP.
