ERS electronic, a specialist in thermal management solutions for semiconductor manufacturing, comes out with the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for advanced packaging.
With the APDM650, ERS takes it a step further. It features ERS’s renowned Thermal Debonding technology and Warpage Adjustment capability which includes the patented TriTemp slide technology that eliminates handling induced warpage. Its efficient automatic debonding and detaping process results in zero tape residue and no excursion. With its contactless transport mechanism, the warpage output can be as low as 4 mm.
The machine’s design also enables a high degree of flexibility. The 650 x 650 mm chuck dimension can be used for different panel sizes, and the loading and unloading mechanism can be customized according to the customer’s different EFEM configurations. Combined with an industry-best temperature uniformity of ±3°C (at operating temperature of 185°C), ERS’s APDM650 is the perfect tool for high volume manufacturing on large panel format.
