CUI Devices’ BGA heat sinks include the HSB family made from aluminum with a black anodized finish and feature adhesive mounting styles.
Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm
Efficient Power Conversion (EPC) unveiled a laser driver that integrates a 40 V, 10 A FET with a gate driver and low-voltage differential signaling (LVDS) logic level input in a single chip for time-of-flight lidar systems used in robotics, drones, augmented reality,
Johnstech International, a specialist in the semiconductor test industry, announced the addition of the SHOTO and YARI Spring Probe Product Lines to the Product Portfolio.
Anyone looking for solutions in the highly competitive commercial testing market can rely on Johnstech to provide a
