ERS electronic, a specialist in thermal management solutions for semiconductor manufacturing, comes out with the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for advanced packaging. With the APDM650, ERS takes it a step further. It features ERS’s renowned Thermal
Tag: packaging
CyberOptics delivers technical presentation about importance of 3D inspection for advanced packaging at SEMICON Taiwan
CyberOptics, a specialist global developer and manufacturer of high-precision 3D sensing technology solutions, will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd. The company will also exhibit WaferSense® and ReticleSense® sensors and feature the
Amkor empowers RF front-end cellular innovations with advanced SiP
Amkor Technology, a specialist provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module design, characterization and packaging technology. With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging