pmdtechnologies comes out with the latest 3D Time-of-Flight camera module, based on the 5th generation REAL3™ ToF image sensor. The module consists of the IRS2877C with VGA resolution depth data output and a newly designed 5µm pmd pixel core.
The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon. With the new 5µm pmd pixel core, the imager offers VGA resolution to provide applications more detailed 3D data – e.g. for secure FaceID for payment and unlock, enhanced photography like advanced autofocus and video bokeh or improved low light performance, 3D reconstruction of faces and objects, improved augmented reality experiences like real-time full 3D mapping and occlusions of virtual objects, photorealistic relighting as well as gesture control and measurement applications.
With a miniaturized design, the new VGA module is a perfect fit for smartphone and mobile integration. By having combined the new pmd/Infineon VGA imager IRS2877C and the new IRS9100C illumination driver IC from Infineon and incorporating additional chip functionalities, the design complexity, module size, calibration effort and BOM were reduced with simultaneously increasing the efficiency.
Of course, the new 3D VGA camera module and built in IRS2877C offer best in class dynamic range and outdoor performance due to the patented technology in every pixel (SBI) as well as ultra-flexible modulation sequences at high frequency for best application performance and data quality.
“The combination of highest resolution, best integratability through miniaturized design and benchmark 3D performance is a milestone in pmd development and for the entire ToF technology,” explains Samuel Freywald, Director Systems & Cameras at pmdtechnologies.
“We’re passionate about setting new standards – and with the new VGA 3D camera module, which uses our IRS2877C imager, we did it again. Not only do we feature best in class performance, but we also provide the most dedicated depth sensing platform to our customers to develop their 3D application, which they can get on the market,” adds Jochen Penne, Executive Board Member and Head of Business Development at pmd.
Hordon Kim, International Editor, hordon@powerelectronics.co.kr
