Credo, a global innovation leader in high performance, low power serial connectivity solutions, announced its participation in the China International Optoelectronic Expo, to be held in Shenzhen, China from September 9-11.
Credo’s exhibition and experts will be demonstrating the company’s latest products at booth space #8A21. The new generation of Credo products both expands the breadth of connectivity solutions offered and delivers on the roadmap to lower power, higher performance and affordability made possible by Credo’s proprietary design architecture and use of mature, manufacturing processes.
“We recently closed a Series D Preferred financing round of $100M to accelerate the commercialization of our breakthrough 400Gbps and 800Gbps connectivity solutions,” said Scott Feller, Credo Vice President, Marketing. “We’re excited to demonstrate this new generation of products at CIOE which extends our penetration in the Hyperscale Datacenter market and expands our reach into the 5G wireless carrier markets,” Feller continued.
Solution demonstrations include:
New 50G Optical DSPs for 5G Wireless Service Providers
Next-Gen 100G/200G/400G Optical DSPs for Hyperscale Data Centers
New Low Power 800G Gearboxes/400G Retimers
Industry-leading security solutions for MACsec and IPsec
7nm and 12nm XSR SerDes IP and Chiplets
Attendees wishing to reserve a demonstration tour/meeting with a Credo expert should contact their local Credo representative or visit https://www.credosemi.com/contact.
Hordon Kim, International Editor, hordon@powerelectronics.co.kr
