Otava has launched Beamformer integrated circuit the OTBF103, which provides end users with a single chip solution for any or all of their spectrum needs. The Beamformer provides frequency coverage from 24 to 40GHz, encompassing the n257, n258, n260, and n261 millimeter wave (mmW) 5G new radio (NR) bands, in addition to coverage for satellite communications and Department of Defense applications.
By employing the same Beamformer device in multiple products and systems, customers can reduce both capital expenditure and the engineering time required to integrate the component into the phased array system. To enable new designs on this chip to be completed even faster, Avnet is launching a supporting Beamformer evaluation board and kit.
By utilizing the GLOBALFOUNDRIES (GF) advanced 90HP silicon germanium (SiGe) 9HP solution based on GF’s 90nm BiCMOS platform, Otava was able to achieve remarkable wideband mmW performance in the Beamformer IC design. In addition to its high bandwidth capability, the process offers low noise and high output power performance in a mature offering. Furthermore, Otava is utilizing GF’s post-fab turnkey services for mmW test and packaging in order to bring a streamlined and cost-effective product to the market.
“Our advanced silicon germanium solution is optimized to meet the accelerated performance demands of high-bandwidth 5G communications systems that are changing the way we live, work, and stay connected to one another,” said Peter Rabbeni, vice president of Mobile and Wireless Infrastructure at GF. “We are pleased to provide advanced manufacturing services in support of Otava’s innovative beamforming chip, with its potential to impact the global 5G rollout, while leveraging our best-in-class post-fab turnkey services.”
“Otava’s design engineers have been creating narrow and wideband mmW SoCs for phased array applications for more than 12 years. The team’s combined expertise includes beamformers, transceivers, and high performance mixed-signal devices in the commercial and DoD spaces. Transitioning into the 5G market was an easy choice considering how of all of our backgrounds seamlessly complement each other,” said Steve Fireman, Otava Co-Founder and the senior vice president of Engineering.
Avnet will support the design process for this new chip through its new Beamformer evaluation kit for design engineers. “The capability this new Beamformer chip brings to market will enable extremely efficient data delivery routes and will reduce interference, enabling a better 5G system,” said Jim Beneke, vice president of Products and Emerging Technologies, Avnet. “Our evaluation board and kit will enable new designs based on this chip to happen even faster.”
The Otava OTBF103’s features include:
* Eight element Tx/Rx TDD Beamformer
* High performance wideband low noise amplifier and power amplifier design
* Independent channel gain control, 20dB range in 0.5dB step size
* Independent channel phase control, 360 deg phase coverage with 5.6 deg step size
* Nominal and low power bias modes
* High speed LVDS or CMOS SPI control with integrated memory
* RMS power detection and temperature sensing
* Eight programmable gate drivers for external Power Amplifier or LNA control
* Eight drivers for external T/R Switch control
Otava’s evaluation board for the Beamformer, the OTBF103-EVAL, will be available for order via the website in January 2021 for $7,499.
Hordon Kim
International Editor, hordon@powerelectronics.co.kr
