MaxLinear’s dual-output power module family addresses industrial applications such as medical and test equipment, allowing outputs to be paralleled for up to 36A or 50A per module, respectively.

The power modules may be paralleled for single power rails up to 300A. The MxL7225-1 provides added flexibility to fine tune the control loop in cases where optimal transient performance is required.

Focused on powering FPGA, DSP and SoC high-current core and memory rails, these modules operate from a 4.5V to 15V input voltage while providing set output voltages from 0.6V to 1.8V. Using an industry standard pinout, designers can easily scale the power levels to match the required load.

Not only do these modules have excellent thermal conductivity to the board, but by placing inductors externally and minimizing mold compound thickness, the case temperature can be as much as 13°C cooler without the complex internal heat-sinking structures found in competing modules.

The MxL7218, MxL7225 and MxL7225-1 are available now in a thermally enhanced 16mm x 16mm x 5.01mm BGA package with RoHS compliant terminal finish and feature an industry standard pinout. The MxL7218, MxL7225 and MxL7225-1 are priced at $33.30, $44.40 and $44.40, respectively in 1,000-piece quantities.

Samples and evaluation boards are available. For more information, visit

Hordon Kim
International Editor,


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