CUI Devices’ BGA heat sinks include the HSB family made from aluminum with a black anodized finish and feature adhesive mounting styles.
Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm x 8.5 mm up to 60 mm x 60 mm with profiles from 6 mm up to 25 mm. Like its existing line of board level heat sinks, these new BGA heat sink models are conveniently measured under four conditions for thermal resistance, making it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system.
CUI Devices’ BGA heat sinks are Thermal resistances measured at 75°C ΔT in natural convection environments range from 6.41 to 39.1°C/W, while power dissipation ratings range from 1.92 up to 11.69 W at 75°C ΔT in natural convection.
The HSB models are available immediately with prices starting at $0.42 per unit at 1000 pieces through distribution. Please contact CUI Devices for OEM pricing.
Lead time is 8 weeks after confirming an order, and price is $0.42 per unit based on 1,000 pieces (through distribution)
Product specifications are available at https://www.cuidevices.com/catalog/thermal-management/heat-sinks/bga-heat-sinks.
