BigBang Semi, a North America based premium provider of Integrated Circuits (IC) design services, joins the Design Center Alliance program (DCA) of TSMC Open Innovation Platform® (OIP), with focus on analog/mixed-mode and RF layout and circuit design solution enablement to lower the design barrier for semiconductor industry.
Founded in 2012, BigBang Semi has been servicing semiconductor companies across the world. With a long and proven track record of successful customer tape-outs, BigBang Semi has been a part of tens of millions of SoCs shipped to-date. Becoming a member of TSMC’s DCA program has been another major milestone undertaken to enable BigBang Semi to provide the microchip industry with proven and trusted design services in the state-of-the-art process nodes including TSMC’s 7nm, 5nm, and 3nm technologies, as well as other specialty technologies.
“We’re very pleased with the addition of BigBang Semi to our Design Center Alliance program to address the growing market need for design services on TSMC’s industry-leading technologies,” said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. “Our partnership with BigBang Semi expands TSMC’s ecosystem and enables our mutual customers to achieve next-generation design success and launch their product innovations quickly to the market.”
“In the era of ever-increasing digitalization, there is a major demand for highly specialized design solutions in nm-FinFET and deep sub-micron technology nodes,” said Ms. Maria Martinez, General Manager of BigBang Semi. “We are proud to be a member of TSMC DCA program enabling customers to reliably and rapidly scale their design teams with the highest quality and professional standards, and most importantly in a secure manner which is of paramount importance”.
