Indium Corporation will feature its high-reliability solder paste and innovative alloy pairing, which provides enhanced performance in automotive applications, at SMTconnect, May 5-7, Nuremberg, Germany.
Indium8.9HF Solder Paste is an industry-proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process for high-reliability automotive electronics.
Indium8.9HF:
– Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
– Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
– Delivers supreme product stability with:
– Excellent response-to-pause, even after being left on the stencil for 60 hours
– Enhanced printing and reflow performance after remaining at room temperature for one month
– Consistent printing performance for up to 12 months when refrigerated
– Offers excellent pin-in-paste and through-hole solderability
– Resists premature flux spread to prevent surfaces from oxidizing
– Performs with both Pb and Pb-free alloys.
Indalloy®292 is an innovative alloy engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
Hordon Kim, International Editor, hordon@powerelectronics.co.kr
