The Global power management IC packaging market is estimated to be US $41.4 billion in 2020, going up to US $ 53.24 billion by 2025, growing at a CAGR of 5.16%, according to RearchAndMarkets.
The key drivers for growth in power management IC packaging market is the increasing demand of smart and wearable devices, growing trend of minimization of device size and the integration of various components into a single device and the need for chip-embedded flexible packaging technology to ensure small size, rapid, and reliable devices.
Complex integration and packaging for multi-power domain SoCs of PMICs is a restraint for this market, whereas the opportunities are in the evolving technologies of 2.5DIC and 3.0DIC and Investment in 3D packaging process design of next-generation smart devices. The primary challenge would be the limited investment in the unification of packaging standards.
Qualcomm Technologies has collaborated with Trimble to develop high-accuracy positioning solutions for connected vehicles. Qualcomm is going to combine Trimble’s RTX technology with select Qualcomm Snapdragon Automotive 4G and 5G platforms, which is expected to provide extremely accurate positioning to maintain the lane position to improve advanced driver assistance systems (ADAS).
Meanwhile, Qualcomm Wireless Communications Technologies Limited (China), a subsidiary of Qualcomm, has collaborated with Tencent Games to work on digital entertainment projects.
