onsemi unveiled the Embedded Power Platform (EPP), a breakthrough architecture that uses the silicon wafer itself as the foundation of the package and introduces a highly integrated approach to power system design.
Designed as a scalable platform, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.
EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a highly integrated wafer-level architecture.
Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market.
EPP also leverages onsemi’s standard 12-inch silicon wafer manufacturing capabilities, bringing key integration processes into the precision and control of the semiconductor fab. This applies mature semiconductor design tools, wafer-level manufacturing and advanced simulation capabilities to power-system integration, helping improve performance while accelerating innovation.
Subaru Corporation is one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures. Through the collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation.
AI infrastructure, electrified transportation, industrial automation are all competing for the same critical resource: power. Customers need to move and manage more electricity within increasingly compact systems while controlling heat, efficiency, cost and development time.
Yet many of today’s power systems are still developed using traditional design approaches that treat power electronics, mechanical design and thermal design as separate engineering challenges, with each layer optimized independently and sequentially.
Decisions made at one stage can create compromises in another, leading to additional engineering iterations, costly late-stage changes and longer development cycles.
