Continental Structural Plastics unveils lightweighting, battery enclosure and materials innovations

Continental Structural Plastics (CSP), along with its parent company Teijin, unveiled an innovative honeycomb Class A panel technology and an advanced, multi-material EV battery enclosure that can be molded in any number of CSP’s proprietary composite formulations. These component technologies were developed

POET’s industry-first flip-chip DML lasers enable world’s lowest-cost and smallest 100G CWDM4 optical engine

POET Technologies has completed and tested its high-speed Directly Modulated Laser (DML) designs using a distributed feedback (DFB) structure and successfully “flip-chipped” these lasers onto the Company’s Optical Interposer platform, which also incorporates several other industry-first accomplishments. The flip-chip assembly technique enables a

Silanna Semiconductor delivers highest power density 30W USB-PD charger design at reduced BoM costs

Silanna Semiconductor announced a breakthrough 30W USB-PD reference design, achieving 21.6W/inch 3 uncased power density from an all-silicon design for a universal input AC/DC power adapter, utilizing their expanded portfolio of Active Clamp Flyback Controllers (ACF). Silanna Semiconductor focuses on the ultimate power