Jeeva announced the world’s lowest power wireless chip for streaming real-time sensor data. Jeeva’s Parsair™ chip consumes 100 times less power than typical Bluetooth and enables many novel use cases previously out of reach due to cost, size and power constraints.
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GaN Systems expands automotive product line
GaN Systems, the global leader in GaN power semiconductors, announced the expansion of its family of automotive-grade 650V transistors. The GS-065-060-5-B-A is a 60A, bottom-side cooled transistor developed for demanding high-power electric vehicle applications such as onboard chargers, traction inverters, and DC-DC
RS Components extends features of DesignSpark PCB PRO
Reno Sub-Systems launches integrated RF power systems for semiconductor manufacturing at 7nm or below
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, introduced its new GenMatch™ Series that integrates the company’s proven solid-state Electronic Variable Capacitor (EVC™) RF match and Precis™ generator technologies into a single
CUI Devices launches VARS program
Winbond and Ambiq collaborate on ultra-low power, intelligent IoT, and wearables
Winbond Electronics collaborates with Ambiq, a recognized technology leader in ultra-low power microcontrollers (MCU), System-on-Chips (SoC), and Real-time Clocks (RTC), to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables. Several customers are in design with