Energous and Thin Film Electronics announced a partnership to simplify the integration of Energous WattUp RF wireless charging and Thinfilm solid-state lithium microbattery technology in form-factor-sensitive applications such as hearables, wearables, and connected sensors. By simplifying the charging method and improving energy
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SCALINX takes strides in 5G communication infrastructures and radar markets with 10.5 million Euro funding
Richardson Electronics continues expansion of power management capabilities with SemiQ third generation SiC diode modules
Solomon Systech begins production of world’s first PMOLED “touch + display” IC
Arteris IP adds record 28 new licensees in 2020
Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that the company added 28 new licensees for its Arteris® IP Ncore®, FlexNoC®, CodaCache®, AI
Syntiant adopts Movellus’ clock network for its low-power NDP120 deep learning processor
Syntiant has adopted Movellus' Maestro platform for its Syntiant® NDP120™ Neural Decision Processor™ (NDP), the edge AI chip company's latest generation of special purpose semiconductors for always-on audio and sensor processing in battery-powered devices. System architects developing SOCs for edge AI, data center,
QuickLogic’s Amazon-qualified reference design brings Alexa to hearables
QuickLogic has released an Amazon-qualified reference design that empowers OEMs and ODMs to evaluate and develop their own smart hearable products quickly and easily. This kit integrates the Alexa voice-initiated Close-Talk experience, enabling a broad set of battery-powered applications to communicate directly
Renesas and LUPA accelerate automotive smart camera development with open platform turnkey solutions
Renesas Electronics and LUPA-Electronics, an automotive safety solution provider, announced the EagleCAM module, an open front camera solution, featuring Renesas’ R-Car V3H and R-Car V3M system-on-chip (SoC) devices. The all-in-one scalable camera platform targets the latest Euro NCAP and C-NCAP requirements, such
[Design Guide] How to integrate an FPC (flexible printed circuit board) antenna for performance
The Fusion Project Works accelerate data management for connected and autonomous vehicles
Airbiquity, Cloudera, NXP Semiconductors, Teraki, and Wind River jointly announced The Fusion Project, an automotive industry collaboration to define a streamlined data lifecycle platform to advance intelligent connected vehicles. The pre-integrated hardware and software solution combines innovative technologies from leading companies for