The organisers of PCIM Asia have confirmed that the 2020 edition of the fair will now take place from 16 – 18 November due in part to disruptions to international travel resulting from the COVID-19 outbreak. Scheduled to take place in early
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Infinera leverages Tower Semiconductor SiGe technology in its industry-leading 800Gbs optical engine
Tower Semiconductor, announced Infinera’s selection of Tower’s high performance Terabit SiGe BiCMOS platform for use in Infinera’s industry-leading 800G sixth-generation Infinite Capacity Engine (ICE6). ICE6 provides 800 gigabits per second single wavelength with unparalleled performance providing significant cost, power, and fiber capacity
Perceive’s processor delivers data center-class accuracy and performance at ultra-low power for consumer devices
InventHelp Inventor develops wind-powered generator for electric cars
Indium Corporation Expert to Participate in Low-Temperature Solders Debate
Huntkey unveils USB-C charger to support fast charging
Huntkey, a leading provider of power solutions, has recently introduced its new model of USB-C charger that features a US plug and a USB-C port to support fast charging. The Huntkey USB-C Charger: https://en.huntkey.com/product/30w-usb-c-port/ The charger can deliver 5V3A, 9V3A, 12V2.5A or 15V2A power outputs
Lumen Group receives UL’s first wireless electric vehicle charging certification
Alchip Technology rolls out high-performance computing packaging capability
Alchip Technologies, a specialist in high-performance computing ASIC, rolled out its Chip-on-Wafer-on-Substrate (CoWoS®) packaging capability. CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs. CoWoS is a 2.5D wafer-level multi-chip packaging technology first introduced by