Ambarella, an edge AI semiconductor company, goes hand in hand with Plus, an AI-based driver assist and autonomous driving (AD) solutions provider. Plus’s PlusVision™—a high-performance transformer-based AD perception software stack with industry-leading power efficiency—is now available on Ambarella’s CV3-AD AI domain controller
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Mobix Labs Launches New Family of Filtered D-Sub Connectors for Defense, Aerospace, Medical, and Commercial Applications
Mobix Labs, a specialist in advanced connectivity solutions, introduced a new family of filtered D-sub connectors designed to eliminate unwanted electromagnetic interference (EMI) in defense, aerospace, medical, and commercial applications. These connectors feature robust construction and superior EMI filtering capabilities, ensuring optimal
Bruker announces successful installation of 1.2 GHz NMR spectrometer at Korea Basic Science Institute
Seoul Semiconductor claims top spot in global display LED market
Unified Power expands critical power services footprint with acquisition of Uptronix
Unified Power, a leading independent provider of critical power services to telecom, datacenter and other customers across industry verticals, has acquired Uptronix of Woodstock, Georgia. "Uptronix has been providing mission critical UPS service for over 44 years. I'm extremely proud of our dedicated
Airgain partners with Waseela to expand growing Middle East market
Airgain, a specialist provider of wireless connectivity solutions, announced its strategic expansion into the Middle East through a partnership with Waseela, a premier master systems integrator delivering innovative ICT solutions across the region. This expansion aligns with the Middle East's rapid technological advancements
Alphawave Semi launches industry-first 3nm UCIe IP with TSMC CoWoS packaging
Alphawave Semi, a specialist in high-speed connectivity and compute silicon for the world’s technology infrastructure, has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology. The complete PHY
Li-Cycle partners with Daimler Truck North America on recycling lithium-ion batteries
Li-Cycle, a specialist lithium-ion battery resource recovery company, supports Daimler Truck North America (DTNA) on its goal to integrate a comprehensive circular economy approach across its operations to reduce its carbon footprint. Li-Cycle and DTNA have a partnership to recycle lithium-ion batteries from
Renesas completes acquisition of Altium
HaiLa Technologies and e-peas Semiconductor showcase first battery-free, Wi-Fi-based extreme-low-power backscatter chip powered by ambient light
HaiLa Technologies (www.haila.io), a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip (SoC) solutions for IoT devices, collaborates with e-peas Semiconductor (www.e-peas.com), an industry-leading provider of energy harvesting and processing solutions, to show the path to extreme long-life
