Alchip Technologies, a specialist in high-performance computing ASIC, rolled out its Chip-on-Wafer-on-Substrate (CoWoS®) packaging capability. CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs. CoWoS is a 2.5D wafer-level multi-chip packaging technology first introduced by
