ADLINK Technology has launched the LEC-IMX8MP SMARC module, the first SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP's next-generation i.MX 8M Plus SoC for edge AI applications. The LEC-IMX8MP integrates NXP NPU, VPU, ISP and GPU computing in a compact size for
Tag: Hordon Kim
[Design Focus] Indoor light energy harvesting
마베니어, 모바일 네트워크 최적화·자동화·보안 지원 위해 AI 및 분석 포트폴리오 확장
LS전선, 싱가포르에 배전급 전력케이블 2년간 공급해
Navitas goes global in Xiaomi’s Mi 11 fast charger
CEA-Leti envisions widespread use of LiDAR systems based on integrated Optical Phased Arrays (OPAs)
Taking a critical step toward developing LiDAR systems for widespread commercial applications, CEA-Leti has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization. OPAs are an emerging technology made of arrays
Siemens and Digital Charging Solutions make it easier for companies to switch to zero-emission fleets
[Hot] Category 8.1 Punch Down Plugs supporting 25 and 40 Gbps Ethernet transmission speeds
Stewart Connector markets Category 8.1 RJ45 Punch Down Plugs that support 25 and 40 Gbps Ethernet transmission speeds over balanced twisted pair copper cabling. They are designed to meet Category 8.1 performance standards in applications as defined by ISO/IEC 11801-1:2017 and ANSI/TIA-568.2-D. Stewart
