Groq's Tensor Streaming Processor (TSP) architecture is capable of 1 PetaOp/s performance on a single chip implementation. The Groq architecture is the first in the world to achieve this level of performance, which is equivalent to one quadrillion operations per second, or
Tag: Hordon Kim
BISTel inks enterprise agreement with leading RF semiconductor manufacturer
BISTel, the world leader in Engineering Equipment Systems (EES) and manufacturing AI software applications for smart manufacturing, announced a company-wide, multi-product, multi-site enterprise agreement with a leading provider of radio-frequency semiconductor devices which help connect a myriad of electronics systems serving military,
Ansys’ multiphysics platform enable H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability
H3C Semiconductor leveraged Ansys simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys' cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development
IBM, 성균관대와 양자 컴퓨팅 연구 가속화 위해 협력해
티유브이 라인란드 코리아, 미국 에너지 스타 프로그램 제삼자 시험소로 지정돼
전기차 배터리용 탄소나노튜브 생산 확대된다
L-com debuts passive DWDM Mux and Demux cassettes and 19” rack-mount units
L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, has introduced a new series of Dense Wave-Division Multiplexing (DWDM) Mux, Demux and Mux/Demux products to address growing metro and regional transport, PON, GPON and FTTx applications. L-com’s
벨로다인 라이다, 혁신적인 센서 기술 공개해
360도 탐지 가능한 6세대 장거리 레이다 센서 출현 !
II-VI expands silicon carbide manufacturing footprint for power electronics in EV and clean energy applications
II‐VI, a specialist in wide-bandgap compound semiconductors, has expanded its silicon carbide (SiC) wafer finishing manufacturing footprint in China to serve the largest worldwide market for electric vehicles (EVs) and for clean energy applications. Spurred by increasing regulatory requirements for lower emissions of