By Dominik Pawlik, ENNOVI (formerly known as Interplex) The following article will look at the various considerations that electric vehicle (EV)manufacturers need to be aware of in relation to powertrain interconnect implementation. It willoutline the main engineering issues that are being faced, and
Tag: interconnect
[OFC 2022] Avicena demonstrates record-breaking ultra-low-energy optical chip-to-chip interconnect
AvicenaTech is demonstrating its LightBundle™ multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA. Interconnects have become the key bottleneck in modern compute and networking systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined
Samtec unveils AcceleRate HP high-performance arrays
Samtec, a specialist manufacturer of a broad line of electronic interconnect solutions, releasd next-gen AcceleRate HP High-Performance Arrays. AcceleRate HP supports 112 Gbps PAM4 extreme performance in an ultra-micro footprint. AcceleRate HP High-Performance Arrays feature an open-pin-field array which maximizes grounding and routing
Rugged Nicomatic rectangular connectors resist high vibration and shock to enable miniaturization in harshest-environment applications
EMM Series connectors from Nicomatic, a specialist manufacturer of high performance interconnect systems, meet or exceed the performance requirements of MIL 83513-G and MIL-DTL 55302G to reduce space and weight in the most extreme environments, including defence, space, motorsport, civil aviation, UAVs