Ansys’ multiphysics platform enable H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability

H3C Semiconductor leveraged Ansys simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys' cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development