Navitas Semiconductor and Magnachip Semiconductor go hand in hand to accelerate adoption of SiC technologies in high-voltage (HV) and ultra-high-voltage (UHV) power markets.
Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC™ Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets.
The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies, enabling Magnachip to build on Navitas’ proven SiC device platforms for next-generation power conversion applications.
Magnachip will also gain access to Navitas’ SiC supply chain and materials ecosystem, supporting faster market entry. At the same time, the technology is planned to be ported, qualified, and internalized at Magnachip’s fab in South Korea.
The companies expect this approach to help accelerate Magnachip’s entry into SiC while maintaining continuity with Navitas’ established technology and materials base. The licensed technologies are expected to support next-generation applications including energy and grid infrastructure, energy storage, industrial electrification, automotive and other high-power systems.
The companies also stated that the agreement encompasses broader engagement beyond SiC. Additional areas of partnership are expected to be detailed and announced later.
