Quectel Wireless Solutions, specialist end-to-end IoT solutions provider, releasedthe SP900BF-AP, a smart module that lets robots, inspection systems and edge gateways run large AI models on the device itself. Built on the Qualcomm Dragonwing™ IQ-9075 Processor and delivering up to 100 TOPS of
Author: 이철민 기자
파워일렉트로닉스 매거진의 뉴스 에디터 입니다. 전력전자 및 배터리, 모빌리티 관련 이야기를 풀어가고 있습니다.
세계 전력·AI 데이터센터 지도, 이렇다
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Power architecture and system-level design enable next era of AI data centers
LITEON Technology and Quanta Cloud Technology (QCT) jointly showcased an AI rack-level infrastructure solution supporting the NVIDIA Vera Rubin NVL72 platform at the 2026 OCP Global Summit. The demonstration features LITEON's 110kW Power Shelf integrated within a rack-level power architecture, highlighting how
Teledyne e2v, 차세대 후면 조사형 글로벌 셔터 CMOS 이미지 센서 제품군인 Nexora 출시
LITEON advances 800VDC grid-to-chip architecture and thermal management solutions
LITEON Technology participated in the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, showcasing its next-generation AI factory infrastructure portfolio centered on 800 VDC architecture. The exhibition features power rack solutions supporting the NVIDIA Vera Rubin platform, integrated power