Qnity Electronics has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).
Stackplane™ slurries support the industry’s move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to deliver the bandwidth and density that AI and high-performance computing need.
Many advanced packaging programs require numerous distinct CMP steps, including planarization following hybrid bonding and through-silicon via (TSV) integration. The Stackplane™ product family brings together a comprehensive slurry portfolio to address the varied requirements of these critical CMP processes.
“Advanced packaging is creating new demands for precision, performance, and reliability across semiconductor manufacturing. As packaging technologies continue to evolve, customers need materials partners that can help address increasingly complex integration challenges,” said Kate Dei Cas, President, Semiconductor Technologies at Qnity. “Qnity already offers one of the industry’s broadest portfolios for advanced packaging, and the new Stackplane™ slurry platform further builds on that capability, supporting customers with end-to-end solutions as they advance their technology roadmaps.”
The Stackplane™ platform combines commercialized products with next-generation slurry technologies under a unified portfolio focused on advanced packaging. The platform includes slurry technologies engineered for consistent planarization at both the wafer and die level, along with the selectivity needed for advanced packaging processes. Key solutions include:
- Stackplane™ SP1000 and SP2000 series for hybrid bonding
- Stackplane™ SP3000 series for TSV applications
- Stackplane™ SP4000 series for polymer CMP
- Stackplane™ SP5000 series for emerging technologies, such as panel-level through-glass vias (TGVs) and glass CMP
