The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, and ETSI Technical Committee Secure Element Technologies (TC SET) announced the adoption of the I3C Interface for SSP (TS 103 818) specification, allowing the MIPI I3C Basicspecification to serve as a physical and logical
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Energous and Atmosic sell wirelessly powered sensor evaluation kit
Energous, a specialist developer of RF-based charging for wireless power networks, and Atmosic Technologies, an innovator in energy harvesting wireless System-on-Chips (SoCs) and modules for the Internet of Things (IoT), are taking orders for the Wirelessly Powered Sensor Evaluation Kit, which features Atmosic’s ATM3
II-VI completes acquisition of Coherent, strenghening businesses of materials, networking, and lasers
MicroEJ partners with Thales to streamline IoT software development
MicroEJ, a leader in software enablement solutions for IoT and embedded devices, announced the availability of its standard Virtual Execution Environment, MICROEJ VEE, for Thales Cinterion® IoT Module and Plug and Play IoT Device portfolio. The partnership strategically aligns both companies’ business models to
[New Product] CUI Devices의 저전력 증분형 인코더 시리즈
pSemi's mmWave beamformer and up-down converter ICs reach volume production
pSemi® announced the production readiness of two new mmWave ICs targeted for active antenna systems in 5G base stations, 5G customer premises equipment and point-to-point radio communication applications. In addition to the 8-channel beamforming front end and dual-channel up-down converter ICs, pSemi offers a
Renesas' highest-performance RZ/T2M motor control MPU enables fast, high-precision control of servo motors
Renesas Electronics announced its highest-performance RZ/T2M motor control microprocessor units (MPUs) for applications such as AC servo drives and industrial robots. The RZ/T2M combines fast and highly precise real-time motor control capabilities and the latest industrial Ethernet on a single chip, while
Renesas' software improve development of EV battery management systems
Renesas Electronics introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs). The new software pairs with Renesas’ industry-leading ISL78714 Li-Ion battery management IC to speed design and optimize performance of next-generation systems. The
Ligado selects Sony Semiconductor Israel as chipset developer for 5G mobile satellite network
Ligado Networks announced a partnership with Sony Semiconductor Israel to develop chipsets for Ligado’s 5G mobile satellite network for the Internet of Things (IoT), marking a significant milestone for deploying advanced connectivity services across North America. Ligado’s 3GPP standards-based 5G satellite IoT network
II-VI develops ultralow power DSP for 100Gbps coherent transmission in optical access networks
II-VI has completed the tape-out of its Steelerton™ digital signal processor (DSP) for 100 Gbps coherent transmission in optical access and aggregation networks. The growth of 5G wireless and high-speed broadband services is driving the explosive demand for coherent transceiver technology optimized for optical