WiMi Hologram Cloud comes out with head-mounted display (HMD) for holographic AR systems. This patent is the result of the independent research and development, which is conducive to further improve the intellectual property protection system, maintain the leading position in technology and
Author: Hordon Kim
[Design Focus] Industry’s lowest profile circuit protection TVS components
ProTek Devices markets a series of high-powered surface mount TVS components for circuit protection from electromagnetic field, lightning, and other electrical fast transients in high power applications. These new devices for motors and relays are provided in that industry's lowest-profile packaging compared
[Hot] AEC Q100 qualified magnetic encoder ICs
[Tech Watch] Disruptive cooling technology
Carrar developed a disruptive, next-generation, holistic cooling solution that effectively addresses the significant challenges in automotive and other industries. With the Carrar system, optimal boiling occurs at extremely low and high heat fluxes, enabling extremely fast charging/discharging, ensuring uniform temperature down to the
NeoVolta’s sloar battery life is extended from 10.95 years to 16.5 years
Thinfilm changes its corporate name to Ensurge Micropower
Establishing its emergence as a leading innovator in the solid-state microbattery market, Thinfilm changed its corporate name to Ensurge Micropower. This new identity builds on the company's fundamental transformation in 2020 and reflects its differentiation and rapid progress in technology, product, and
NXP ramps automotive processing innovation with two processors on TSMC 16nm FinFET technology
Kandou unveils first device in USB-C multiprotocol retimer product family for USB4
Kandou unveiled the first product from the Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support and the only commercially available USB4 retimer to work across all system-on-chip (SoC) platforms. Production silicon samples are available for KB8001, the first in the Matterhorn
Broadcom delivers industry’s broadest portfolio of fiber optics, PHY and switch solutions for 100/200/400/800G data center connectivity
Broadcom announced the availability of its expanded portfolio of 100Gb, 200Gb, 400Gb and 800Gb electro-optics platform solutions for data center and cloud networks. Introducing the industry’s first 100Gb PAM-4 VCSEL and multi-mode kit, proven 112Gb PAM-4 PHY with direct-drive technology, and uncooled
II-VI unveils 100 Gbps indium phosphide directly modulated lasers for high-speed transceivers in datacenters
II‐VI introduced the 100 Gbps indium phosphide (InP) directly modulated lasers (DMLs) for high-speed transceivers deployed in datacenters. The growing demand for 400 and 800 gigabit Ethernet (GbE) transceivers is driving substantial investments in technology advancements of DMLs due to their lower cost