Efficient Power Conversion (EPC) unveiled the EPC91128, EPC91129, EPC91130, and EPC91131 evaluation boards - compact, high-performance 3-phase BLDC motor drive inverter platforms designed to accelerate development of next-generation motor control systems using GaN technology. The boards are built around EPC's integrated EPC23108–EPC23111 ePower™ Stage ICs. They can handle
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
마우저, ST의 STM32C5 Arm Cortex-M33 기반 메인스트림 MCU 공급
마우저 일렉트로닉스(Mouser Electronics)가 ST마이크로일렉트로닉스(STMicroelectronics, 이하 ST)의 Arm® Cortex®-M33 코어 기반 메인스트림 마이크로컨트롤러(MCU)인 새로운 STM32C5 시리즈를 공급한다. STM32C5 MCU는 스마트 홈, 소비가전, 산업, 로보틱스, 웨어러블, 컴퓨터 주변기기 등 엔트리급의 비용 효율적인 애플리케이션 개발을 지원하도록 설계됐다. 마우저에서 구매할 수 있는 ST의 STM32C5 시리즈는 별도의 외부 가속기가 필요 없고 144MHz로 동작하는 Arm Cortex-M33 코어(FPU 탑재,
휴머노이드 설계의 핵심 프로그램, 바로 이거 !
Frenetic partners with SZ Dore to deliver AI-based magnetics and power design tools in Asia
Frenetic Electronics, the company that offers a pioneering web-based custom magnetics design platform, has signed an agreement with Szdore Electronics of Shenzhen, China, to provide local support for designers. The company sees that closer relationships with customers is critical for the adoption of its
Molex unveils multi-channel liquid cooled busbar capability to power next-generation AI data centers
Molex launches the new Multi-Channel Liquid Cooled Busbars. As intensive AI workloads drive rack power requirements toward the 1-megawatt (MW) threshold, traditional air-cooled infrastructure has hit a physical limit. Molex bridges this “AI Thermal Gap” by extending liquid cooling into the power-distribution layer,
PI unveils space-saving, ultra-slim auxiliary PSU reference designs for NVIDIA Kyber 800 VDC AI data center
Polar Semiconductor and Nexperia partner on power MOSFET manufacturing to strengthen global supply stability
Polar Semiconductor collaborates with Nexperia to manufacture next generation power MOSFET devices at Polar Semiconductor’s U.S.-based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s deep expertise in power semiconductor manufacturing and ongoing
Pickering guide highlights benefits of reed relays for EV and chargepoint testing
Pickering Electronics has published an application guide for engineers taking high voltage (HV) measurements and performing insulation testing in electric vehicles (EVs) and charging points. The guide, titled: ‘Reed Relays for Electric Vehicle and Charge Point Testing’, explains why high-isolation reed relays are ideal for
Diodes’ single-chip synchronous buck controller simplifies automotive USB Type-C charging designs
Diodes unveiled the APK43070Q, a highly integrated, automotive-compliant* synchronous buck controller in combination with a USB Type-C® PD3.1 source controller. This level of integration reduces the number of external components, lowers BOM cost, and simplifies the design of high-power USB Type-C charging ports. Typical
