EPC Space unveiled the EPC7C021, a high-performance, three-phase motor demonstration board featuring the radiation-hardened EPC7011L7C eGaN® IC. Designed for ease of evaluation and system integration, the EPC7C021 delivers a user friendly, flexible platform for developing motor drive applications such as reaction and momentum wheels, ion thrusters, robotics
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Toshiba un veils automotive photorelay with 1800V output withstand voltage
Toshiba Electronic Devices & Storage has launched an automotive photorelay, “TLX9165T,” in a 10pin SO16L-T package, that supports high voltage automotive batteries with an output withstand voltage of 1800V (min). Volume shipments start today. Improved charge times and longer cruising ranges are essential
Nexperia brings benefits of clip-bonded FlatPower packaging to bipolar junction transistors
Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering released as MJPE-series addresses the ongoing industry demand for more power-efficient and cost-effective designs in both industrial and automotive
Diodes’ 64GT/s PAM4 linear ReDriver features enhanced signal quality for PCIe 6.0 interface speeds
Diodes unveiled the industry’s first ReDriver™ to reach PCI Express® (PCIe®) 6.0 protocol speeds (up to 64 GT/s) while being backwards-compatible with PCIe 5.0/4.0/3.0 protocols. The PI3EQX64904 is a low-power, high-performance, 64GT/s, four-differential-channel, PAM4, linear ReDriver. Target applications include AI data centers
Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket
Smiths Interconnect, a specialist provider of innovative solutions for critical semiconductor test applications, launched DaVinci Gen V, the latest test socket in its DaVinci series portfolio. The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide unwavering reliability and
Same Sky unveils latching power relays
Quectel unveils high-performance Zigbee & BLE module for smart lighting, building and home networks
Quectel Wireless Solutions launched its latest high-performance MCU Zigbee and BLE module, the KCMA32S. This innovative module is designed to meet the growing demands of IoT applications, featuring advanced connectivity options and a compact form factor. Powered by Silicon Labs’ ultra-low-power EFR32MG21 wireless SoC,
LG Energy Solution and First Phosphate push forward LFP supply chain in North America
Nexperia boosts wide-bandgap portfolio with 1200V SiC Schottky diodes for power-intense infrastructure
Nexperia added two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding portfolio of power electronics components. The PSC20120J and PSC20120L have been designed to address the demand for ultra-low power loss rectifiers which enable high-efficiency energy conversion in industrial applications. As such they
JEDEC releases LPDDR6 standard to enhance mobile and AI memory performance
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-6, the latest Low Power Double Data Rate 6 (LPDDR6) standard. JESD209-6 is designed to significantly boost memory speed and efficiency for