Valens announces successful tapeout of first MIPI A-PHY compliant chipsets for long-reach, ultra-high-speed automotive connectivity

Valens has completed a successful tape-out of its VA70XX chipsets – the first on the market to comply with the MIPI A-PHY; standard for long-reach, ultra-high-speed automotive video connectivity. The samples are set to be evaluated by leading OEMs and Tier 1s, some

Westell unveils innovative public safety class A & B bi-directional amplifiers

Westell Technologies announced an expansion to the ClearLink™ line of In-Building wireless solutions with the release of its new ProtectLink™ Series of Public Safety Bi-Directional Amplifier (BDA) products. ProtectLink™ Public Safety BDAs meet all of the requirements and are listed to the new

Boréas Piezo Haptic Engine brings HD haptics in tiny footprint to fitness trackers and smartwatches

Boréas Technologies unveiled the Boréas Piezo Haptic Engine (Boréas PHE), the first module to harness the high performance of piezo actuators to solve wearable devices' most significant challenge—achieving true high-definition (HD) haptic feedback in a broad range of low-power space-constrained devices. The

Nexa3D expands partnership with BASF Forward AM to deliver ultrafast photoplastics for rapid prototyping

Nexa3D, the maker of ultrafast stereolithography production 3D printers, has expanded its partnership with BASF Forward AM to deliver three new ultrafast photopolymer materials through its expanding Nexa3D channels globally. Nexa3D’s collaboration with BASF Forward AM leverages their combined capabilities to deliver faster

Akoustis’ nine new patents cover BAW filter devices and methods for 5G, WiFi 6, WiFi 6E and C-V2X

Akoustis Technologies announced the issuance of nine new patents related to its innovative BAW resonators, piezoelectric materials, XBAW® manufacturing process, wide-bandwidth RF filters and its applications in 5G mobile and other wireless devices. The new issuances bring the total number of Akoustis’ patents