onsemi has signed a collaboration agreement with GlobalFoundries to develop and manufacture advanced gallium nitride (GaN) power products using GF’s state-of-the-art 200mm eMode GaN-on-silicon process, starting with 650V. This collaboration accelerates onsemi’s roadmap for high-performance GaN devices and integrated power stages, expanding
English News
Amprius expands Korea Battery Alliance with three vew contract manufacturers
Amprius Technologies, a specialist innext-generation lithium-ion batteries with its Silicon Anode Platform, announced the expansion of the Amprius Korea Battery Alliance following a successful launch event in Daejeon, South Korea. The Alliance now includes three additional contract manufacturers who join a consortium of Korean companies that
Wolfspeed powers Toyota’s EV platforms with highly reliable silicon carbide components
Wolfspeed announced that its automotive MOSFETs will power onboard charger systems for Toyota, one of the most respected and quality-driven automakers in the world. Wolfspeed’s silicon carbide components will be integrated into Toyota’s Battery Electric Vehicles (BEV). This silicon carbide device adoption reflects
imec and Japan’s ASRA partner to harmonize standardization of automotive chiplet architectures
imec announced a strategic alignment initiative with Japan’s Advanced SoC Research for Automotive (ASRA), aimed at harmonizing the standardization of chiplet architectures for automotive applications. Imec and ASRA have agreed to jointly explore and promote shared architecture specifications, giving partners confidence that
Cell Impact is named Europe’s flow plate manufacturer of the year
Sigenergy and The Mobility House Energy publish white paper “Fundamentals and Applications of Bi-Directional Charging”
Sigenergy, a specialist energy innovator in energy storage system, and The Mobility House Energy, partnered with an energy flexibility aggregator and trader, to release a white paper titled “Fundamentals and Applications of Bi-Directional Charging”. Drawing on both companies’ first-mover experience in commercial
EMASS and Semtech collaborate on low-power Edge AI
EMASS, a Nanoveu subsidiary specializing in nextgeneration semiconductor technology, announced a strategic collaboration with Semtech to bring low-power edge AI solutions integrated with LoRaWAN® connectivity to market. EMASS’s ECS-DoT AI-enabled system-on-chips (SoCs) integrate Semtech’s LoRa® transceivers, enabling long-range, battery-efficient intelligence for industrial,
ROHM launches SiC MOSFETs in TOLL package achieving miniaturization and high-power capability
ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size
Navitas partners with Cyient Semiconductors to accelerate GaN adoption in India’s AI, mobility, industrial, and energy markets
Navitas Semiconductor and Cyient Semiconductors have announced a strategic long-term partnership intended to advance the adoption of GaN technology in India and establish a complete, end-to-end GaN ecosystem. Through this partnership, Navitas Semiconductor and Cyient Semiconductors intend to co-develop GaN products, digital and mixed signal ICs, GaN based system modules and design enablement platforms targeting India’s high voltage, high
FiRa Consortium uneils FiRa Core 4.0 Specifications and Certification Program
The FiRa® Consortium announced the release of its Core 4.0 Specifications and Certification Program, notable milestones in ultra-wideband (UWB) technology development. These updates complete the work of IEEE 802.15.4-2024 features to fulfill FiRa-defined use cases. They also enhance FiRa’s capabilities, enabling seamless interoperability