Alchip Technologies, a high-performance computing ASIC design company, announced that it had assisted Preferred Networks, the Japanese leader in deep learning technology, with the development of that company's ground-breaking MN-3 supercomputer. The MN-3, powered by the MN-Core™ deep learning processor, recently won 1st
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Ossia goes hand in hand with FIH Mobile to expand wireless power technology
Ossia announced a strategic partnership with FIH Mobile. By joining forces, both companies will together deliver unique design and manufacturing capabilities for the Cota technology. FIH is a leading design, development and manufacturing services provider, offering a comprehensive array of services for leaders
Indium introduces ultra-thin precision performance
Indium Corporation will feature its precision materials for high-reliability 5G communications during the International Microwave Symposium (IMS) virtual exhibition from Aug. 4-6. Indium Corporation provides a suite of leading-edge materials and technology expertise to solve the evolving challenges of 5G communication applications. This
Pepperl+Fuchs invites you to its first online summit
Nexperia’s automotive-qualified discretes save space up to 90 percent
Nexperia unveiled the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors
HiSilicon and Nowi showcase energy autonomous, power-free solution in smallest size
POET- Sanan IC joint venture aims to disrupt data center market
POET Technologies has signed a Letter of Intent to establish a joint venture with Xiamen Sanan Integrated Circuit to manufacture cost-effective, high-performance optical engines based on POET’s proprietary CMOS compatible Optical Interposer platform technology. The proposed joint venture ('JV') will be formed with
Kyoto Semiconductor’s KP-H high-speed photodiode with lens-integrated chip-on-carrier achieves 40GHz bandwidth
Kyoto Semiconductor has developed a high-speed photodiode KP-H KPDEH12L-CC1C to support 400Gbps transmission systems that use PAM4 (Pulse Amplitude Modulation 4) inside and between data centers. With the introduction of this InGaAs photodiode, the company is continually supporting the increasing speeds and
LinkSwitch-TN2 high-voltage switcher ICs from Power Integrations are now certified for automotive use
High-reliability, space-saving buck/flyback switcher ICs target 400 VDC EV applications Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced an AEC-Q100-qualified version of its LinkSwitch™-TN2 switcher IC for buck or non-isolated flyback applications. Featuring an integrated 750
Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Up to 90% space saving over current SMD devices; AOI-capable Nexperia announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching,