Toshiba Electronic Devices & Storage has launched its first lineup of 4-channel high-speed standard digital isolators for automotive applications. The new "DCM34xx01 Series” features 10 devices that support stable operation with high common-mode transient immunity (CMTI) of 100kV/μs (typ.)[1] and high data transmission
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Semtech launches ESD protection device for automotive ethernet
Semtech announced availability of the RClamp10022PWQ, a two-line transient voltage suppressor designed specifically for automotive Ethernet applications. The new device is fully compliant with Open Alliance specifications for 10BASE-T1S, 100BASE-T1 and 1000BASE-T1 automotive Ethernet interfaces. The RClamp10022PWQ features robust ±15kV contact and ±25kV air
PsiQuantum releases manufacturable chipset for photonic quantum computing
PsiQuantum announced Omega, a quantum photonic chipset purpose-built for utility-scale quantum computing. Featured in a newly published paper in Nature, the chipset contains all the advanced components required to build million-qubit-scale quantum computers and deliver on the profoundly world-changing promise of this
TI’s industry-first space-grade 200V GaN FET gate driver enables smaller and more efficient satellites
Texas Instruments (TI) announced a new family of radiation-hardened and radiation-tolerant half-bridge gallium nitride (GaN) field-effect transistor (FET) gate drivers. This family of gate drivers includes the industry’s first space-grade GaN FET driver that supports up to 200V operation. The devices are
Oso Semiconductor closes $5.2M round to power next-generation phased array antennas in satellite communication, 5G and radar systems
Oso Semiconductor, a developer of power-efficient, high-performance, low-cost chipsets for next generation wireless communication and sensing applications, has raised an oversubscribed $5.2 million seed round. Oso Semiconductor will use the capital to build pre-production beamforming chipsets and evaluation systems for initial customers in
Telechips launches Korea’s first high-performance mobility network processor
Telechips has introduced AXON (TCN100x), a high-performance network processor designed for mobility applications. AXON is a network System on Chip (SoC) that supports the highest safety level ASIL-D in ISO26262, ensuring top-tier safety and performance. It aids global automakers and top-tier companies in transitioning to
Kinetic Technologies’ PoE-powered device interface supports input power levels up to 90W
Power management leader Kinetic Technologies expands its portfolio with the introduction of its KTA1142 device. A single-chip, highly integrated solution designed to deliver power to any Power over Ethernet (PoE) Powered Device (PD). The KTA1142 simplifies system design and enhances power efficiency
Bruker launches advanced X-ray microscope for 3D microscopy in industrial and scientific applications
Bruker launched the new X4 POSEIDON™, a high-performance 3D X-ray microscope (XRM) using micro-Computed Tomography (microCT). This innovative benchtop XRM system offers advanced capabilities comparable to larger, floor-standing systems to make high-resolution 3D X-ray microscopy accessible for demanding XRM applications in industrial
Amtar Technologies secures $18.5M CAD angel round to advance wireless SoC with edge computing for next-gen connectivity
Emtar Technologies, a fabless semiconductor company pioneering energy-efficient wireless edge intelligence solutions, has successfully closed its $18.5M CAD Angel Round in 2024. Since commencing operations in 2023, Emtar has been developing next-generation system-on-chip (SoC) and semiconductor technologies. This funding will further accelerate
MaxLinear and RFHIC deliver high-efficiency power amplifier solution for 5G macro cell radio units
MaxLinear, a specialist in wireless infrastructure silicon solutions, and RFHIC announced that RFHIC’s GaN power amplifiers (PA) and MaxLinear’s Sierra single chip Radio SoC have together delivered breakthrough energy efficiency for very high power macro cell Radio Units (RU). This combined PA solution