Shin-Etsu Chemical has created a 300-mm (12-inch) QSTTM substrate, which is a substrate dedicated to GaN epitaxial growth, and recently started supplying samples. Shin-Etsu Chemical has sold 150-mm (6-inch) and 200-mm (8-inch) QSTTM substrates and GaN on QSTTM epitaxial substrates of each diameter. Meanwhile, the company
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JEDEC publishes essential test method to address switching energy loss in wide bandgap and silicon semiconductor power devices
JEDEC Solid State Technology Association announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices. Developed jointly by JEDEC’s JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees, JEP200 is available for free
Microvast and Minespider show battery passport demo at IAA Transportation 2024
Xendee and UIUC deliver phased approach to power data centers with renewables and advanced nuclear
Xendee, a specialist provider of the leading design and operation platform for distributed energy systems, partners with researchers from the Department of Nuclear, Plasma, and Radiological engineering (NPRE) at University of Illinois Urbana-Champaign (UIUC) to analyze and develop distributed energy solutions that
CyberPower launches PFC Sinewave 1U rackmount UPS systems
Cyber Power Systems, a specialist in power protection and power management products, launched PFC Sinewave UPS (uninterruptible power supply) systems in a rackmount 1U form factor, joining its best-selling product line for electronics requiring Active PFC (power factor correction) power source compatibility. Providing
Valens Semiconductor gets three automotive design wins from leading European OEMs for its VA7000 MIPI A-PHY chipsets
DELO unveils microelectronics adhesive for ultra-fine structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous integration and optical packaging applications. Able to realize unlimited freeform structures and razor-thin optical barriers, the material