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Home >> Posts tagged "3D sensing"

Tag: 3D sensing

[Hot] ams OSRAM’s 3D sensing portfolio with four new VCSEL modules

  • English News
by Hordon Kim - 2021-11-17

The number of applications which utilize 3D sensing technology continues to increase: from the detection of the surroundings for robots to avoid collisions to the unlocking of smartphones via facial recognition. But 3D sensing also plays an important role for augmented and

[Hot] Allegro Microsystems’ magnetic position sensor for next-generation ADAS applications

  • English News
by Hordon Kim - 2021-08-05

Allegro Microsystems'  A31315 sensor is a rotary and linear magnetic position sensor IC for automotive and industrial applications. 3DMAG sensors combine Allegro’s proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z), enabling true 3D sensing capabilities

Allegro’s 3DMAG magnetic position sensor enables next-generation ADAS applications

  • English News
by Hordon Kim - 2021-05-25

Allegro MicroSystems, a specialist in power and sensing solutions for motion control and energy-efficient systems, released the A31315 sensor, the newest member of the 3DMAG™ family of rotary and linear magnetic position sensor ICs for automotive and industrial applications. 3DMAG sensors combine

[Design Focus] 3D sensing for facial and object recognition

  • English News
by Hordon Kim - 2021-02-27

Three dimensional (3D) technology is a momentous scientific breakthrough. It is a depth-sensing technology that augments camera capabilities for facial and object recognition. The process of capturing a real-world object’s length, width, and height with more clarity and in-depth detail than can

TriLumina releases world’s first ‘LED Killer’ device for mobile 3D sensing

  • English News
by PEMK 매거진 - 2019-07-16

TriLumina (www.trilumina.com), a specialist developer of flip-chip VCSEL(vertical-cavity surface-emitting laser) technology for 3D sensing, launched the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, which allows for lower costs and higher performance than existing

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