Knowles' IA8201 audio processor packs 1.44MB of memory, numerous interface options, and dual 175MHz cores with voltage scaling in a tiny 2.6x3mm eWLB package and a 6.0x6.0mm QFN package. Low power is achieved with a combination of cores offering the best combination of
Tag: Mobile
Ossia goes hand in hand with FIH Mobile to expand wireless power technology
Ossia announced a strategic partnership with FIH Mobile. By joining forces, both companies will together deliver unique design and manufacturing capabilities for the Cota technology. FIH is a leading design, development and manufacturing services provider, offering a comprehensive array of services for leaders
Honeywell’s Advanced Materials Help Mobile Devices Dissipate Heat To Perform Better
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better. Leading mobile electronics manufacturers are using Honeywell’s thermal interface materials (TIMs) to dissipate the intense heat produced