Soitec, a specialist in the design and production of innovative semiconductor materials, and Mersen, a global expert in electrical specialties and advanced materials, have entered into a strategic technical partnership to develop a new family of polycrystalline silicon carbide (poly-SiC) substrates for the
Tag: SiC
온세미, GT 어드밴스드 테크놀로지스 인수 완료
마이크로칩, 업계 최초 SiC MOSFET용 디지털 게이트 드라이버 출시 및 양산 지원
UnitedSIC, 업계 최상의 6mΩ SiC FET 출시
UnitedSIC, 업계 최상의 6mΩ SiC FET 출시
[New] UnitedSiC’s Gen 4 SiC FETs featuring high performance and design flexibility
Axcelis begins shipment of ‘Purion SiC Power Series’ implanter to chip makers in Asia
어플라이드 머티어리얼즈, 신기술 개발로 SiC 반도체 제조사 200mm 웨이퍼 전환 지원해 성능 및 전력 효율 향상
[신제품] 빠른 속도와 정확도로 제품 설계를 단순화 해주는 전류 센서
QP Technologies installs wire bonders, broadening reach in mil-aero, RF and power markets
QP Technologies™ (formerly Quik-Pak), a specialist provider of innovative microelectronic packaging and assembly solutions, has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. The fully automated bonders allow QP Technologies to provide more advanced wedge bonding