GaN power devices have shown great potential in the high efficiency and high-power markets, especially in the high-reliability markets such as automotive applications. Yet, not all GaN devices are the same.
To meet these demanding metrics, VisIC Technologies has designed a technology that best meets both performance and high-reliability requirements. The high current, low on resistance (RDSON) and a top cooled ceramic package of the D3GaN platform allow for higher power density and better efficiency compared to Silicon and Silicon Carbide.
VisIC’s D3GaN provides substantial advantages to power conversion systems. The high current, low on-resistance (RDSON) and a top cooled ceramic package of the D3GaN platform allow to design for higher power density and better efficiency compared to Silicon and Silicon Carbide devices, which are especially important to the automotive market. This market requires a high level of reliability, well beyond the needs of many commercial applications.
As VisIC has focused on this high-reliability market segment, the process to identify the device lifetime and quality level is crucial to satisfying the market needs. This paper will describe the approach as well as the results taken to validate high reliability and quality of D3GaN.
The company runs a whitepaper which addresses the advantages and demonstrations related to the high-reliability requirements of VisIC’s depletion-mode D3GAN device.
Hordon Kim
International Editor, hordon@powerelectronics.co.kr
