Qualcomm Technologies announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly™ C1000 CPU, Qualcomm® High Bandwidth Compute (HBC), Qualcomm Dragonfly™ AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
온세미, 시냅틱스 인수로 차세대 피지컬 AI를 위한 교두보 확보해
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무라타제작소, 제품 데이터베이스 내 전 제품을 대상으로 한 API 서비스 제공 개시… 세라믹 커패시터·인덕터에 더해 73개 제품 카테고리로 대폭 확대
NORD의 배터리 셀 생산용 드라이브 솔루션
AI가 소비자를 대신할 수 있을까…
Dracula Technologies pioneers sustainable OLED and organic electronics opportunities beyond OPV
Dracula Technologies, a recognized leader in energy-harvesting solutions, has brought innovative energy-harvesting solutions to the IoT industry through its LAYER® OPV technology, which efficiently harvests ambient light to eliminate the need for batteries. With a proven track record in organic photovoltaic (OPV) technology,
[DigiKey] 지속 가능한 설계 실현을 위한 첨단 전자 기술 조명 동영상
EMASS achieves AI function fusion with voice recognitionand real-time keyword detection
Nanoveu, a technology company specialising in advanced semiconductor, visualisation and materials sciences, announced EMASS has had a breakthrough demonstration in real-time keyword detection and voice recognition fused as two AI functions, running entirely on its ECS-DoT edge AI co-processor. Both capabilities run
Not all high density reed relays perform the same…
In high-density test systems, space matters. Engineers are often trying to fit more channels into smaller PCB areas, while still maintaining signal integrity, measurement accuracy and long-term reliability. This is where compact reed relays, such as Pickering’s 3.9 mm Series 120, can offer significant