BigBang Semi, a North America based premium provider of Integrated Circuits (IC) design services, joins the Design Center Alliance program (DCA) of TSMC Open Innovation Platform® (OIP), with focus on analog/mixed-mode and RF layout and circuit design solution enablement to lower the
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Energous’ 1W active energy harvesting developer kit supports over-the-air wireless charging for IoT applications
Energous announced the availability of its 1W Active Energy Harvesting Developer Kit. The 1W Developer Kit can charge multiple devices simultaneously, enabling at-a-distance wireless charging for the growing Internet of Things ecosystem. This technology represents the lowest cost, smallest size solution
Brenntag distributes functional silanes in 19 European countries
Evonik has recently extended its distribution agreement with Brenntag for its Dynasylan® product line to 16 countries in Eastern Europe. Effective immediately, Brenntag will additionally distribute the silane products in Poland, Czech Republic, Slovenia, Slovakia, Hungary, Serbia, Romania, Bulgaria, Croatia, Macedonia, Bosnia
Transphorm wins $1.4 million contract from Defense Advanced Research Projects Agency
Transphorm, a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products, has been awarded a $0.9 million contract with a $0.5 million option by the Defense Advanced Research Projects Agency (DARPA). This contract, W31P4Q-21-C-0009, commissions
RECOM adds 1W and 0.5W options to SOIC-16 family of DC/DC converters
Embark and ZF collaborate to validate automatic steering control in self-driving trucks
Embark Trucks Inc, a specialist developer of autonomous technology for the trucking industry, and ZF, a top global Tier-1 supplier, collaborate to test, validate, and integrate ZF’s ReAX adaptive steering technology to ensure compatibility with the Embark Universal Interface (EUI). This collaboration will
Kymeta announces grant of new U.S. patent for multi-beam capabilities enabling simultaneous multi-orbit connectivity
Kymeta, the communications company making mobile global, announced that the United States Patent and Trademark Office awarded Kymeta Corporation a U.S. Patent for its multi-beam antenna configuration, enabling redundant, simultaneous, multi-orbit satellite connectivity. Kymeta’s innovative patented technology can generate two beams simultaneously with
VIWEST selects Sierra Wireless 5G radio module for mobile ultra-high-definition video encoders
EPC expands 40V eGaN® FET product line with device ideal for high-power density telecom, netcom, and computing solutions
Kopin receives follow-on order of silicon backplane wafers for 2K x 2K OLED microdisplays
Kopin, a specialist developer and provider of high-resolution microdisplays and display subassemblies for consumer, defense, enterprise, industrial and medical products, has received an approximately $850,000 follow-on order for its proprietary Lightning® 2K silicon backplane wafers. “We are proud to receive an additional follow-on