Hordon Kim

Nexperia’s Trench Schottky rectifiers increase efficiency for fast switching applications

English News

by Hordon Kim - 2021-05-04

Nexperia extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100 V and 20 A. The new parts feature excellent switching behavior and leading thermal performance. They are available in Nexperia’s Clip Bond FlatPower (CFP) packages which have

[Hot] Medical sensor for endoscope and catheter cameras

English News

by Hordon Kim - 2021-05-04

OmniVision Technologies' OH0TA OVMed® medical image sensor with a package size of just 0.55 mm x 0.55 mm, features a 1.0 micron pixel and a 1/31” optical format—smaller than the Guinness World Record held by its predecessor for the “Smallest Commercially Available

[Case study] Faurecia customizes cockpit experience for Chinese consumers

English News

by Hordon Kim - 2021-05-04

China has rapidly grown into the world’s largest automotive market, embracing new solutions linked to auto megatrends such as connectivity, shared mobility and electrification, as well as areas like health and wellness. Based on 25 years’ presence in China, Faurecia has

CEA-Leti announces EU project to mimic multi-timescale processing of biological neural systems

English News

by Hordon Kim - 2021-05-04

CEA-Leti launched an EU project to develop a novel class of algorithms, devices and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems that can process efficiently real-world sensory signals and natural

CUI Devices adds slide switches product line to switch portfolio

English News

by Hordon Kim - 2021-05-04

CUI Devices’ Switches Group announced the addition of slide switches to its product portfolio. Available in compact package sizes as small as 10 x 2.5 x 5.9 mm, the MSS series is a family of mini slide switches featuring 2.54 mm pitches,

Valens announces successful tapeout of first MIPI A-PHY compliant chipsets for long-reach, ultra-high-speed automotive connectivity

English News

by Hordon Kim - 2021-05-04

Valens has completed a successful tape-out of its VA70XX chipsets – the first on the market to comply with the MIPI A-PHY; standard for long-reach, ultra-high-speed automotive video connectivity. The samples are set to be evaluated by leading OEMs and Tier 1s, some

Avnet Silica offers high-capacity industrial-grade NVMe drives

English News

by Hordon Kim - 2021-05-04

Avnet Silica began stocking the IX SN530 solid state drives (SSDs) from Western Digital. Utilizing a 96-layer 3D construction, these compact Non-Volatile Memory Express (NVMe) modules are highly suited to industrial implementation. They provide the storage resources needed for data-intensive factory automation

Westell unveils innovative public safety class A & B bi-directional amplifiers

English News

by Hordon Kim - 2021-05-04

Westell Technologies announced an expansion to the ClearLink™ line of In-Building wireless solutions with the release of its new ProtectLink™ Series of Public Safety Bi-Directional Amplifier (BDA) products. ProtectLink™ Public Safety BDAs meet all of the requirements and are listed to the new

Boréas Piezo Haptic Engine brings HD haptics in tiny footprint to fitness trackers and smartwatches

English News

by Hordon Kim - 2021-05-04

Boréas Technologies unveiled the Boréas Piezo Haptic Engine (Boréas PHE), the first module to harness the high performance of piezo actuators to solve wearable devices' most significant challenge—achieving true high-definition (HD) haptic feedback in a broad range of low-power space-constrained devices. The

ERNI extends MicroSpeed connector family with new signal variants and complementary power connectors

English News

by Hordon Kim - 2021-05-04

ERNI is expanding its MicroSpeed product family in the signal area to include variants with the additional pin counts 26, 32 and 44, plus unshielded connectors are also being added in the power supply group. With the expanded range of variants, ERNI