Electriq Power, a developer of intelligent and integrated home energy storage, management, and monitoring solutions, has entered into a definitive agreement with Emergent Microgrid, a provider of turnkey microgrids with community-concentrated deployments in Santa Barbara and Montecito, California. Emergent Microgrid will bolster
Author: Hordon Kim
POET signs up development and supply agreement with leading European optical systems company for a 400G data center application
Samsara’s Nano-Bag features invisible hydrophobic coating to protect bacteria
Navitas and Chargeasap deliver world’s most powerful GaN multi-input fast charger
Power Integrations targets compact smart-lighting designs with highly efficient GaN-powered LYTSwitch-6 LED drivers
Power Integrations, the leader in high-efficiency, high-reliability LED-driver ICs, today announced a new member of the LYTSwitch™-6 family of safety-isolated LED drivers for smart lighting applications – the LYT6078C. This new LYTSwitch-6 IC uses Power Integrations’ PowiGaN™ gallium nitride (GaN) technology to
E Ink and TCL CSOT partner for world’s first 8.5-generation production line for ePaper TFT backplanes
Nexperia’s automotive TrEOS ESD protection combines high signal integrity, low clamping voltage and high surge robustness
[Tech Watch] Contact-based and over-the-air wireless power transmitter technology
[Tech Watch] Ultrasonic power-at-a-distance Wireless Energy
There are many ways to transfer electrical power wirelessly – induction, magnetic resonance, RF and infrared lasers – all of which are electromagnetic. Issues with using electromagnetic energy to transfer power include interference, tissue penetration, material heating and strict FCC/FDA regulations capping
Dialog Semiconductor expands automotive PMIC offering with new family of high-current DC-DC (buck) converters
Dialog Semiconductor announced the DA913X-A product family, a new line of highly efficient, high-current, automotive-grade, step-down DC-DC (Buck) converters. The highly integrated DA913X-A devices require fewer external components than competing solutions, enabling a low system BoM cost and a reduced solution footprint. The