Toshiba Electronic Devices & Storage Corporation has launched two new photorelays "TLP170AM" and "TLP170GM" in a small 4-pin SO6 package, for security systems, building automation and other industrial equipment. The new products feature a maximum trigger LED current of 1mA, which reduces input
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
VORAGO reduces size of radiation-hardened Arm Cortex® MCUs into BGA packages for defense and aerospace
VORAGO Technologies announced the expansion of the highly integrated Radiation-Hardened Arm® Cortex® Microcontroller (MCU) family into Ball Grid Array packages. This announcement promises an increase of functionality options spanning size and scope while incorporating the company's patented HARDSIL® technology. The expansion of packages
Alchip Technologies opens 5nm ASIC design capabilities
Alchip Technologies became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December. Alchip's complete 5nm design-to-delivery methodology focuses on minimizing design turnaround time. Physical design attributes include a
Indium Corporation Expert to Present at CHARGED EVs Virtual Conference
Indium Corporation’s Joseph Hertline, Product Manager – ESM/Power Electronics, will present on materials solutions for high-reliability power electronics assembly during CHARGED Electric Vehicles (EVs) virtual conference, Sept. 1-3. As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging,
Lion Semiconductor’s switched-cap power ICs are embedded in more than 50 million smartphones
Lion Semiconductor announced that its switched-capacitor power ICs are used in more than 50 million smartphones. This milestone comes 2 years after the company started production shipment. Lion Semiconductor's high efficiency switched-capacitor power ICs enable world's fastest charging in smartphones while maintaining cool
Vishay snap-in power aluminum capacitors enable higher power density and increased longevity
Ossia partners with Toyota to expand wireless power technology
Littelfuse’s smalled PPTCs protect portable devices from overcurrent, overtemperature conditions
Littelfuse, a specialist manufacturer of leading technologies in circuit protection, power control and sensing, unveiled a new series of PPTCs designed to help make the next generation of today’s most-used consumer electronics smaller and more reliable. The PolySwitch® zeptoSMDC series provides robust overcurrent and overvoltage
pSemi expands portfolio with two high-performance digital step attenuators
pSemi, a specialist company focused on semiconductor integration, announced the expansion of its digital step attenuator (DSA) portfolio with two new high-performance DSAs, PE43610 and PE43614. Featuring industry-leading attenuation accuracy, the PE43610 and PE43614 DSAs support the entire 9 kHz–13 GHz and
MACOM expands GaAs MMIC portfolio with two wideband power amplifier products
MACOM Technology Solutions, a leading supplier of semiconductor solutions, announced at the virtual International Microwave Symposium (IMS), two new wideband MMIC power amplifier products, the MAAM-011291-DIE and MAAM-011277-DIE. The MAAM-011277-DIE is a wideband 0.25 Watt power amplifier. This power amplifier has 22 dB of linear