StratEdge, a specialist in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announced that the white paper, “Eutectic Die Attach Optimizes High Power GaN Devices,” is now available on the StratEdge website
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Supplyframe helps power EDOM digital transformation, global expansion
Supplyframe announced an agreement to digitally transform EDOM Technology, a leading semiconductor and component distributor in Asia, for greater agility, resilience and sustainable growth. This effort marks the first time a major semiconductor distributor based in Asia will embrace digital transformation and
Schneider Electric introduces Easy UPS 3L 500 and 600 kVA to make business continuity easy
Extends medium Easy UPS 3-phase UPS range up to 600 kVA (400V) for external batteries Compact 3-phase UPS simplifies and streamlines configuration, use, and service Schneider Electric, the leader in digital transformation of energy management and automation, today announced the introduction of Easy UPS
Diodes’ precision operational amplifier features ultra-low input offset voltage and low noise
Diodes unveiled first precision operational amplifier. The AS2333 uses chopper stabilization to achieve ultra-low input offset voltage of 8µV (typical) and near-zero drift (0.02µV/degree C, typical) over time and temperature. The chopper stabilization also addresses low frequency 1/f noise and offset voltage
MACOM initiates 100G PAM4 Digital Signal Processor(DSP) production
MACOM Technology Solutions, a specialist supplier of semiconductor solutions, announced design completion and production release of its low power CMOS DSP-based PAM4 PHYs. MACOM’s PAM4 PHYs with integrated DSP, forward error correction (FEC) and multiplexing functionality are designed to enable single-wavelength 50 Gbps
Mixel MIPI D-PHY IP is integrated into Perceive’s Ergo edge inference processor
Mixel’s MIPI® IP solution has been successfully integrated into Perceive’s Ergo™ edge inference processor which is currently being sampled and will be in mass production in the near future. Perceive’s Ergo edge inference processor brings breakthrough accuracy and performance to consumer devices such
Palma Ceia SemiDesign began customer sampling of the new chip for the 802.11ax Wi-Fi standard
Alchip provides supercomputer processor design support
Alchip Technologies, a high-performance computing ASIC design company, announced that it had assisted Preferred Networks, the Japanese leader in deep learning technology, with the development of that company's ground-breaking MN-3 supercomputer. The MN-3, powered by the MN-Core™ deep learning processor, recently won 1st
Ossia goes hand in hand with FIH Mobile to expand wireless power technology
Ossia announced a strategic partnership with FIH Mobile. By joining forces, both companies will together deliver unique design and manufacturing capabilities for the Cota technology. FIH is a leading design, development and manufacturing services provider, offering a comprehensive array of services for leaders
Indium introduces ultra-thin precision performance
Indium Corporation will feature its precision materials for high-reliability 5G communications during the International Microwave Symposium (IMS) virtual exhibition from Aug. 4-6. Indium Corporation provides a suite of leading-edge materials and technology expertise to solve the evolving challenges of 5G communication applications. This